Objective:The objective is to reduce the size and increase efficiency of a mechanically pumped fluid loop.
Targeted Improvements:To increase the heat exchange performance by a factor of 4 per unit area.
Description:Growing heat dissipation of high performance electronics has created the demand for more efficient cooling systems for scientific and large telecommunication satellites. This forces platform designers to move from conventional heat pipe systems and deploy alternative cooling technologies, such as one- or two-phase fluid loops. However, single phase heat transport loops suffer from a boundary layer between the working fluid and the metal surface. This significantly reduces the heat transfer capability. The principle of the technology is based on disrupting the boundary layer of the heat transfer fluid in the heat exchange zones. This is expected to be achieved by application of an electric fieldinteracting with a dielectric coolant fluid.
In this activity the fluid dynamics in the heat exchange zone shall be studied and various implementation options to disrupt the boundary layer by electrohydrodynamic (EHD) forces. An electrohydrodynamically enhanced cooling loop Breadboard shall be designed, manufactured and tested integrated with the mechanically pumped fluid loop and related Ground Support Equipment Test-Bed.
Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes".