WAVEGUIDE FLANGES WITH ENHANCED PASSIVE INTERMODULATION PERFORMANCE (ARTES AT REF. 5C.276) - EXPRO PLUS

Description

The objective of this activity is to develop waveguide flanges with ultra-low PIM performance for space applications. The new flange intends to become new state-of-the-art with improvement of the PIM performance from typically -140 dBc to -210 dBc (3rd order PIM).

Targeted Improvements:

The new flange intends to become new state-of-the-art with improvement of the PIM performance from typically -140 dBc to -210 dBc (3rd order PIM).

Description:

With the advent of high power channel communication satellites, Passive Intermodulation (PIM), has arisen as a spacecraft performance of considerable importance. PIM is of great concern due to the risk of polluting very weak receive signals. Waveguide flanges have been identified as major source of Intermodulation Products in telecommunications satellites. Actual satellite requirements push technology to achieve levels of PIM above 200 dBc. The design of low PIM flanges usually leads to solutions with a quite significant contribution to the overall harness mass. Reducing the mass of the flanges would have a direct benefit on the satellite cost.

The activity shall concentrate in the development of a novel waveguide flange based on techniques involving not only the pressure distribution between two flanges but selecting the right materials and coating to achieve smooth contact between surfaces. Alternatively, the design should also look into the possibility to use different heat expansion coefficients (flanges vs bolts) to increase the contact. The development will be limited to standard RF cross-sections.

The design shall consider as a minimum:

  • Novel flange geometry for forces distribution and optimum electrical contact.
  • Suitable materials with Young Module suitable for best metal contact.
  • Fasten bolts distribution and geometries.
  • Thickness of the flange.
  • Flange alignment.
  • Metal surface coating, polishing and finishing (grooves).

The activity includes the following tasks and work logic:

1. Trade-off and preliminary analysis of the low PIM flange geometries.

2. Trade-off of material and processes.

3. Proof of concept design, manufacturing and test of the flanges.

4. Design, manufacturing and RF testing of EMs.

A number of waveguide EMs with novel flanges will be designed, manufactured and tested. The selection of the frequency band will be accordingly to the available PIM test benches.

Tender Specifics