Description
The objective of the activity is to test electrical insulation methods to replace reliable electrical insulation by reliable simpleelectrical insulation and to provide inputs to guidelines to ECSS-E-ST-20C Rev2.Targeted Improvements:Mass, volume, manufacturing time reduced by a factor of 2 compared to current reliable insulation technologies.Description: Double insulation rules lead tooversize electrical architectures to make them robust to simple failure. This translates in time, mass and volume as well as constraining designs that act against the increasing requirement for integration of functions and thermal dissipation. Long discussions are then required with the satcom operators in order to decide if a design is safe or not. The activity will consist in identifying where double insulation is requested, where failures happened (e.g. PCB, sliprings). Then alternative designs will be presented and applied when possible. This includes new processes and materials. A breadboard test campaign will be carried out to exercise all possible failures including particles and contamination. Those tests will take place in vacuum and in a plasma and will cover a range of voltages >200V and on complex connection interfaces (e.g. 90 deg connectors) as well as different materials. The activity will establish manufacturing processes compliant with ECSS-E-ST-20C Rev 2 and will be used as inputs to guidelines to this ECSS.