The selected grounding method and routing methods are a combination of well-known materials, products and methods in the space industry with slight adaptions.
The grounding is ensured through a rivet via Stand-off and e.g. a conductive tape directly to the structure or to a given grounding area. The deleted grounding via wire to a grounding insert is the main benefit.
Trade-offs performed for different, tested MLI grounding methods have led to the selection of a Multi-Layer-Insulation Bonding Point, which combines the extensive heritage of the State of the Art washer grounding method with a newly introduced grommet or hollow rivet.
After further properties comparison between the grommet and a hollow rivet the aluminium rivet has been selected for any further testing. The reasons for this selection have been
- the same manufacturing effort
- overall a lower el. resistance (Rivet to layer)
- a lower magnetic moment due to the rivet
- consists of standardized parts (with different lengths if needed for thick lay-ups)
- standardized, low cost riveting tools are available.
This properties result in lower manufacturing costs and a better electrical and electro-magnetic performance.
For structure grounding 4 different methods have been detected which all guarantee a reliable sufficient grounding.
These methods are via Chofoil, metallic foil & conductive tape, metallic foil & screw, as well as via electrically conductive, acrylic Adhesive. Also a combination of different grounding methods including the State of the Art method via Bonding Lead is possible.
For a selection for a specific grounding the surface temperature, the surface material and the given requirements need to be taken into account.