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Requirements for Function & Performance, Environment, Physic & Resource and General requirements have had to be taken into account.
This leads to significant less engineering, design, management and manufacturing costs on panel / S/C side especially for higher levels
The grounding is ensured through a rivet via Stand-off and e.g. a conductive tape directly to the structure or to a given grounding area. The deleted grounding via wire to a grounding insert is the main benefit.
For a selection for a specific grounding the surface temperature, the surface material and the given requirements need to be taken into account.
5 different MLI grounding points have been taken into account with 7 different connectors and 2 different fixation methods to the S/C.