Description

The objective of the activity is to design, manufacture and test Q/V/W-band frequency converters based on a single chip core MMIC for telecommunication payloads employing Digital Transparent Processors (DTP).Targeted Improvements:- Footprint and mass reduced bya factor of 10.- Power consumption reduced by a factor of 3 to 5.Description:For Digital Transparent Processors (DTP) pre- and post-processors are needed in order to up- and down convert to and from baseband or an intermediate frequency. However, pre- and post-processors are still based integration techniques similar to stand-alone frequency converters where a large number of individual MMICs are used. This leads to a large footprint as well as a power consumption of typically 3 to 5 W. Both footprint and power consumption could be drastically reduced by employing a higher integration level and using single chip frequency converters similar to lower-frequency, single-chip Ku- and Ka-band frequency converters.This activity will design, manufacture and test Q/V/W-band frequency converters based on a single chip core MMIC to replace today's bulky pre- and post-processors.